Glass is an inorganic, solid material that is brittle yet hard at the same time. Numerous applications use drilled glass. This delicate material can be met in customer electronics, medical, automotive, aerospace, and many other industries.
Glass is a widely used material, not only for consumer electronics. Processing (cutting or micro-structuring) tempered or non-tempered, flexible, or thick glass with high precision can be a challenging task. Mesh glass wafers and wafers for wafer-level-packaging (WLP) require various shapes of through-holes with high aspect ratio channels in the same wafer. Femtosecond lasers are perfect for both selective laser etching (SLE) and 5-axis drilling heads.
The CARBIDE laser is a common choice for SLE and glass drilling applications.
- 190 fs – 20 ps 连续可调脉宽
- 最大输出 1 mJ @ 120 W 或 2 mJ @ 80 W
- 单脉冲 – 2 MHz 重复频率
- POD 和 BiBurst 功能
- 高达 5 次谐波或可调谐扩展
- 风冷型号
- 紧凑的工业级设计
- Burst-in-burst 功能– BiBurst，即脉冲串包含子脉冲串功能
- 1 kHz – 2 MHz 载波频率
- 190 fs – 20 ps 连续可调脉宽
- 可调节的振幅斜率
- 可调整GHz和MHz的脉冲数